The hottest Chapter II molding process of plastic

2022-08-02
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Chapter II molding process of plastic packaging materials (XXXII)

notes: ① prepare with distilled water; ② Drop the solution from brown to transparent, and the activation operation can directly carry out alkaline electroless copper plating, or use formaldehyde to reduce and then electroless copper plating

s alkaline electroless copper plating. See table 2-90 for ABS alkaline electroless copper plating conditions. When using, pour liquid B into liquid a, and the coating thickness is 0.2-0.4 μ m。 Table 2-91 and table 2-92 are the reference formulas for alkaline electroless plating

table 2-90 ABS alkaline electroless copper plating conditions

formula conditions 1 the government will also draft a plan 2 conditions 3 a solution potassium sodium tartrate (chemically pure) concentration/(g/l) 450500 NaOH (chemically pure) concentration/(g/l) 910 ~ 1210 Na2CO3 (chemically pure) concentration/(g/l) 45-2 thiobenzothiazole concentration/× - - 0.25 copper sulfate (c.p.) content in ethyl liquor/(g/l) 141010 nickel chloride content (c.p.)/(g/l) 41 - formaldehyde content (37%)/(ml/l) 5310 ~ 1510 temperature/℃ 20 ~ 3020 ~ 2530 time/min 20 ~ 3045 ~ 6030 Table 2 - 91 basic electroless copper plating reference formula unit: g/l

raw material formula 1 Formula 2 Formula 3 formula 4 CuSO4 10 ~ 2030 ~ 4010 ~ 2510 ~ 20 NaOH 10 ~ 50 100 ~ 150 200 ~ 250 25 ~ 35 glycerin 5 ~ 20 - lactic acid - 140 ~ 200 - citric acid - 250 ~ 350 - potassium sodium tartrate - 100 ~ 150 Table 2 - 91 The volume ratio of the solution in and 37% formaldehyde water is 4:1

table 2980.7-92 negative sign reference formula for alkaline electroless plating (II) unit: g/l

raw material formula I formula II CuSO4 735 NaOH 650 potassium sodium tartrate 30170 nickel chloride 1-na2co3 at the 2016 coal trading conference held in Ordos

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